As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Date: Jun 25, 2026 | 9:00 AM PST
In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys
Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
