Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
Sponsored by: Cadence
Presented by: Nitin Bhagwath, Director of Product Management
Event Duration: 60 minutes
Abstract:
Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal… Read More