Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit

Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
by Daniel Nenni on 09-14-2026 at 6:00 am

Samtec Connects the AI Era

Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More