Tag: Dr. Henry Sheng

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Chiplet Q&A with Henry Sheng of Synopsys

Chiplet Q&A with Henry Sheng of Synopsys
by Daniel Nenni on 05-05-2023 at 6:00 am
Categories: Chiplet, EDA, Events, Synopsys

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.

Are we
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Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am
Categories: Chiplet, EDA, Events, Synopsys

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the preface… Read More