2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification

2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification
by Daniel Nenni on 03-25-2024 at 10:00 am

Dvcon 2024

2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it.  Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More