Die-to-Die IP enabling the path to the future of Chiplets Ecosystem

Die-to-Die IP enabling the path to the future of Chiplets Ecosystem
by Kalar Rajendiran on 05-30-2022 at 6:00 am

Die to Die Interface Figure of Merit

The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More


Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets

Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
by Kalar Rajendiran on 04-19-2021 at 10:00 am

Comparison of D2D PHY and XSR SerDes OpenFive

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More