A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More
Webinar: From Copper to COUPE: Scaling AI Interconnects with Co-Packaged Optics
Featured Speakers:
- Igor Elkanovich, CTO, GUC
- Sheng-Fan Yang, Director, GUC
- Madhumita Sanyal, Sr. Director Product Management, Synopsys
Co-packaged optics (CPO) breaks through the data movement constraint by moving optical engines next to the XPU, reducing electrical reach from centimeters to millimeters and delivering
