The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal.
TIME:
MARCH 22, 2023
11 AM EDT / 3 PM GMT / 8:30 PM IST
Venue:
Virtual
The 2023 R1 release for Ansys Icepak offers
The ever-increasing need for faster, smaller, and multi-tasking electronic devices poses a significant thermal management challenge for the processor and the system. Manufacturers need to strike a good balance between hardware-based and software-based thermal management strategies to avoid overdesign and minimize the
Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT. The 2022 R2 update will describe the new features & capabilities of the Icepak and Mechanical Thermal simulators in detail.
Time:
September 6, 2022
11 AM EDT / 4 PM BST / 8:30 PM IST
Venue:
Virtual
About this Event
Thermal and Mechanical
