Webinar: Mastering 3D-IC Design Challenges Through Advanced Simulation
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams.
TIME:
October 1, 2024
SESSION ONE: 11 AM EDT / 5 PM CEST / 8: 30 PM IST
SESSION TWO: 8 PM EDT / 2 AM CEST (+1 day) / 5:30 AM IST (+1