Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit

Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
by Daniel Nenni on 09-14-2026 at 6:00 am

Samtec Connects the AI Era

Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More


How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26

How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26
by Mike Gianfagna on 06-23-2026 at 6:00 am

How Samtec Blazes a Trail to 224:448 Gbps at DesignCon 26

I recently covered what Samtec was doing at DesignCon 26. Samtec has a tendency to dominate any show it attends in multiple dimensions. The prior post focused on the company’s contributions to the technical agenda and the high-profile experts in attendance. While all that is interesting and valuable, attending a large show like… Read More