eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSilicon… Read More
Tag: 2.5d chips
Going up…3D IC design tools
3D and 2.5D (silicon interposer) designs create new challenges for EDA. Not all of them are in the most obvious areas. Mentor has an interesting presentation on what is required for verification and testing of these types of designs. Obviously it is somewhat Mentor-centric but in laying out the challenges it is pretty much agnostic.… Read More