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DVCON EUROPE 2026
The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application...
May 5, 2026
ThinkPad Headset 8550 (Aura Edition) powered by Ceva RealSpace® delivers low-latency, head-tracked spatial audio to enhance immersion...
May 5, 2026
May 5, 2026
Plano, Texas, USA
Siemens has collaborated with Arm to support verification of the Arm® AGI CPU (image courtesy of Arm)
-...
May 5, 2026
May 4, 2026
Washington, D.C., USA
- Siemens reaches investment milestone as projects in Pittsburgh, Pa. Buffalo Grove, Ill. and Fort...
May 5, 2026
April 30, 2026
Australia
From left to right: Professor Allison Kealy (Swinburne University), Jose Moreira (Siemens), Professor Mehdi...
May 5, 2026
Hmm, that's a quite interesting testing problem. Would anyone volunteer to give a lot of virgin, unused DRAM and flash of around 5 years...
May 5, 2026
Apple has been in talks with Intel since the first iProducts were being designed 15+ years ago. Those talks and talks with other...
May 5, 2026
P
A
A very illuminating input. Now, I got it. 3D will likely lag behind 2D DRAM on anything, but capacity, and therefore the big S hesitates
May 5, 2026
- Apple explores US chip partnerships with Intel Samsung
- Strategy aims to diversify semiconductor supply chains
- Talks support...
May 5, 2026
P
From POC to manufacturing is more than 8 years. and this POC was done in a lab, not a fab. I have a detailed lifecycle that expalins...
May 5, 2026
P
Hmm, that's a quite interesting testing problem. Would anyone volunteer to give a lot of virgin, unused DRAM and flash of around 5 years...
May 5, 2026
M
From POC to manufacturing is more than 8 years. and this POC was done in a lab, not a fab. I have a detailed lifecycle that expalins...
May 5, 2026
Is this true that 3D DRAM tech processes are so different that you cannot really upgrade a 2D RAM fab for it?
From what I hear first...
May 5, 2026
3D DRAM is much harder to make than 3D NAND. If it's Si-based, you need to start with a Si/SiGe superlattice with 100+ layers that is...
May 5, 2026
In my experience - (DRAM) memory seems to age whether it's being used or not :). Though the ones that age to failure "on the shelf"...
May 5, 2026
AmandaK posted the thread DVCon Europe 2026: Engineering Paper & Tutorial Deadline Extended! in General Press.DVCON EUROPE 2026 The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application...
Xebec reacted to Paul2's post in the thread NEO Semiconductor's 3D X-DRAM for AI processors has passed proof-of-concept validation — company secures funding to develop next-gen HBM alternative with
Like.
Hmm, that's a quite interesting testing problem. Would anyone volunteer to give a lot of virgin, unused DRAM and flash of around 5 years...
Daniel Nenni replied to the thread Apple in Talks with Intel, Samsung for US Chipmaking.Apple has been in talks with Intel since the first iProducts were being designed 15+ years ago. Those talks and talks with other...
Sad.
From POC to manufacturing is more than 8 years. and this POC was done in a lab, not a fab. I have a detailed lifecycle that expalins...
