Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=111569
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2031070
[XFI] => 1060170
)
[wordpress] => /var/www/html
)
You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today !
JavaScript is disabled. For a better experience, please enable JavaScript in your browser before proceeding.
You are using an out of date browser. It may not display this or other websites correctly.
You should upgrade or use an
alternative browser .
F
ASML has been following the FEL technology for at least 2 decades or so I think. ASML follows many novel EUV source technologies like...
Apr 30, 2026
Isn't 14A still "vanilla" EUV? I thought it was 10A targeting High NA EUV.
Apr 30, 2026
This is basically HBM, next generation. It's still vertically stacked DRAM dies with TSV connections on top of logic base die.
Apr 30, 2026
Intel and SoftBank, through their subsidiary Saimemory, have been developing an alternative technology to the popular high-bandwidth...
Apr 30, 2026
The other curveball is - what's needed for peak AI inference performance keeps changing. FP vs. Integer, precision levels, and even...
Apr 30, 2026
A lot will depend on cost per token vs interactivity profile of different suppliers plus effectiveness of agents. If NVIDIA gets to a...
Apr 30, 2026
TSMC asked customers and they said no hurry on HNA-UEV. The risk/reward is not there yet. Simple as that. This topic came up in the...
Apr 30, 2026
Yay, Intel is getting back into memory! Or who is going to manufacture this?
Apr 30, 2026
ASML has been following the FEL technology for at least 2 decades or so I think. ASML follows many novel EUV source technologies like...
Apr 30, 2026
F
I think Intel is just responsible for the stacking part. The DRAM is from PSMC apparently. The logic base die, if it had been made on...
Apr 30, 2026
F
Yay, Intel is getting back into memory! Or who is going to manufacture this?
Apr 30, 2026
Yay, Intel is getting back into memory! Or who is going to manufacture this?
Apr 30, 2026
B
Business traction on 22nm continues to gain momentum, accounting for 14% of Q1 revenue
Expect Q2 wafer shipments to grow by high single...
Apr 30, 2026
Intel and SoftBank, through their subsidiary Saimemory, have been developing an alternative technology to the popular high-bandwidth...
Apr 29, 2026
This is basically HBM, next generation. It's still vertically stacked DRAM dies with TSV connections on top of logic base die.
Apr 29, 2026
Like.
ASML has been following the FEL technology for at least 2 decades or so I think. ASML follows many novel EUV source technologies like...
Xebec replied to the thread TSMC's refusal of ASML's expensive High-NA EUV equipment, explained.Isn't 14A still "vanilla" EUV? I thought it was 10A targeting High NA EUV.
user nl reacted to Daniel Nenni's post in the thread TSMC's refusal of ASML's expensive High-NA EUV equipment, explained with
hist78 reacted to kvas's post in the thread Intel Prepares HBM Killer: HB3DM Memory Stacks with Z-Angle Technology with
Haha.
Yay, Intel is getting back into memory! Or who is going to manufacture this?
kvas replied to the thread Intel Prepares HBM Killer: HB3DM Memory Stacks with Z-Angle Technology.Yay, Intel is getting back into memory! Or who is going to manufacture this?
Daniel Nenni reacted to XYang2023's post in the thread Intel Prepares HBM Killer: HB3DM Memory Stacks with Z-Angle Technology with