Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=108942
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2031070
[XFI] => 1060170
)
[wordpress] => /var/www/html
)
You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today !
JavaScript is disabled. For a better experience, please enable JavaScript in your browser before proceeding.
You are using an out of date browser. It may not display this or other websites correctly.
You should upgrade or use an
alternative browser .
Was the 6-year $127 billion CapEx spending a bust?
Or was the $127 billion used ineffectively/unwisely with dismal returns?
Mar 11, 2026
S
"While the executive admitted that the MacBook Neo is a real threat, he questioned its capabilities to handle complex tasks that may...
Mar 11, 2026
M
this is true. are you aware of ASE or Amkor solutions?
Mar 11, 2026
E
There is nothing common between H200 and VR both uses different Node different packing different Arch different HBM the only thing i see...
Mar 11, 2026
M
Yeah it's a very nice part only 80mm2 18A with N6 PCH that is joined with UCIe no advanced packing here it is
It's for edge...
Mar 11, 2026
M
People want Intel 7 and not Intel 3/18A. Intel apparently took down capacity on 7 with the idea people would move to 18A. Then financial...
Mar 11, 2026
L
There is nothing common between H200 and VR both uses different Node different packing different Arch different HBM the only thing i see...
Mar 11, 2026
From 2020 to 2025, Intel spent $127 billion in CapEx to build fabs and purchase equipment. How is it that after six years of buildup...
Mar 11, 2026
The company redirected some of its chips production to meet surging server demand, but analysts say it’s missing out on emerging...
Mar 11, 2026
C
CoWoS-L is TSMC's version of EMIB. Blackwell (among other products) use CoWoS=L in volume production.
Mar 11, 2026
S
Yeah it's a very nice part only 80mm2 18A with N6 PCH that is joined with UCIe no advanced packing here it is
It's for edge...
Mar 11, 2026
M
Do ASE or Amkor have technologies to compete with EMIB and are they make products today for customers?
Mar 11, 2026
M
Question: Is TSMC fully loaded in 2026 and turning away customers on N3? N2? @Daniel Nenni
Mar 11, 2026
M
I think they are doing some of that. But remember the margins are higher on Intel 7 products. I think you have have mentioned Wildcat...
Mar 11, 2026
M
Some people argue it is the middle-sized one:
https://www.foreignaffairs.com/iran/curse-middle-sized-wars
In 1988, the military...
Mar 11, 2026