Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=105568
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2030970
[XFI] => 1060170
)
[wordpress] => /var/www/html
)
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A
Just read an arthicle on Ukraine using cheap drones to take out expensive targets, producing a hundred drones a day at low cost Taiwan...
Jan 21, 2026
A
With TSMC’s planned $250 billion investment in Arizona and additional billions in Capex to be spent in Taiwan, it’s hard to see what...
Jan 21, 2026
X
Fab 62 is for 18A? Hopefully Intel internal products ramp up so 62 is necessary and maybe add some foundry business.
I don't recall if...
Jan 21, 2026
X
This was for a process that is in HVM for a while
For a brand new process and to get the yield up and fab 62 will get build if they...
Jan 21, 2026
X
You can't build a fab in US in just 2 years TSMC Arizona took like 3-4 Years !!!
Jan 21, 2026
Any advanced packaging technology will be an added cost. If Intel can use its buying power to integrate cheaper (compared to what OEMs...
Jan 21, 2026
It's expensive
Jan 21, 2026
Can you please expand on this comment?
Jan 21, 2026
S
This was for a process that is in HVM for a while
For a brand new process and to get the yield up and fab 62 will get build if they...
Jan 21, 2026
With TSMC’s planned $250 billion investment in Arizona and additional billions in Capex to be spent in Taiwan, it’s hard to see what...
Jan 20, 2026
But it takes even longer for Intel to build a fab and bring it into high volume manufacturing (HVM) with a good yield.
It took TSMC 3...
Jan 20, 2026
My understanding was that there wasn't just one problem, it was a combination of aggressive design rules (physical and electrical) plus...
Jan 20, 2026
I have heard the same no one knows exactly why it happened but i think we all know the guy that tried to cover it up and was successful...
Jan 20, 2026
You are correct.
Some issues
1) at least as of 3 years ago, There were LTD process integration people at Intel who said the process was...
Jan 20, 2026
Like.
With TSMC’s planned $250 billion investment in Arizona and additional billions in Capex to be spent in Taiwan, it’s hard to see what...
Any advanced packaging technology will be an added cost. If Intel can use its buying power to integrate cheaper (compared to what OEMs...
tomatoma replied to the thread Lip-Bu Tan Update on 18A and 14A.It's expensive
hist78 replied to the thread TSMC faces a capacity shortage, leading six major foundries to choose Samsung over Intel for manufacturing?.With TSMC’s planned $250 billion investment in Arizona and additional billions in Capex to be spent in Taiwan, it’s hard to see what...
My understanding was that there wasn't just one problem, it was a combination of aggressive design rules (physical and electrical) plus...