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Including Intel
Jan 7, 2026
Like Samsung, Intel started production before yield was what TSMC requires for HVM. From what I know, in regards to yield, both TSMC and...
Jan 7, 2026
Intel started production of 18A in April (assumed in D1). Intel started production wafers in Arizona in summer. Not sure where all...
Jan 7, 2026
Most of the N2 design starts that I am aware of are N2P besides the obvious ones at Apple and MediaTek. AMD is using both N2 and N2P...
Jan 7, 2026
Quietly? :ROFLMAO:
Intel 18A and TSMC N2 both went HVM in Q4 2025. It is hard to tell with Samsung 2nm since they have a different...
Jan 7, 2026
N3E is better suited for iGPU is both denser and more performant than Intel 3 has better PPA overall
i knew about 1 as for Yields don't...
Jan 7, 2026
Both NVIDIA and AMD had some pretty dramatic "launches" on the hardware side at CES as well. In my mind, the most significant are the...
Jan 7, 2026
Legitimately curious as to what you base this statement on. I seem to recall Zinsner indicating they still had some work to do on cost...
Jan 7, 2026
Also Wildcat Lake
Jan 7, 2026
agreed RAMP is going to be costlier initially but Intel will spread it over multiple products on 18A over a longer period of time
Jan 7, 2026
I'm sure that is true, but my point is that you have 4 different die rolled up into one package. Without knowing what kind of pricing...
Jan 7, 2026
i think 18A is going to be the costliest of the bunch considering die size the base die is 22nm FFL and is cost optimized so 274mm2...
Jan 7, 2026
I don't think it will be that simple. The compute tile is 18A the graphics tile is either 3nm or TSMC and the platform controller tile...
Jan 7, 2026
same Xe, Intel 3 +19% larger than TSMC N3E, if the extracted numbers from the cartoon are correct
Jan 7, 2026
I think you're right from a technical perspective, but I also suspect cost and capacity could play a major role in the decision here...
Jan 7, 2026