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K
we have the chip size for over a year
Die 4 is 18A Compute
Die 1 is N6 PCH/IO
Die 5 is N3E GPU
rest is filler die
Jan 6, 2026
S
agreed RAMP is going to be costlier initially but Intel will spread it over multiple products on 18A over a longer period of time
Jan 5, 2026
A
I'm sure that is true, but my point is that you have 4 different die rolled up into one package. Without knowing what kind of pricing...
Jan 5, 2026
S
i think 18A is going to be the costliest of the bunch considering die size the base die is 22nm FFL and is cost optimized so 274mm2...
Jan 5, 2026
A
we have the chip size for over a year
Die 4 is 18A Compute
Die 1 is N6 PCH/IO
Die 5 is N3E GPU
rest is filler die
Jan 5, 2026
A
I don't think it will be that simple. The compute tile is 18A the graphics tile is either 3nm or TSMC and the platform controller tile...
Jan 5, 2026
F
we have the chip size for over a year
Die 4 is 18A Compute
Die 1 is N6 PCH/IO
Die 5 is N3E GPU
rest is filler die
Jan 5, 2026
S
Including Intel
Jan 5, 2026
S
It was the Intel Pentium processor, and the year was 1994.
https://medium.com/@kambizhoma/the-500-million-math-mistake-ad91e29271ea...
Jan 5, 2026
S
we have the chip size for over a year
Die 4 is 18A Compute
Die 1 is N6 PCH/IO
Die 5 is N3E GPU
rest is filler die
Jan 5, 2026
S
Intel is laying down the iGPU guantlet in their slides:
"82% faster than AMD HX 370", while consuming less power: 45W vs 53W sustained...
Jan 5, 2026
D
Get the chip size.
Then we can get the basic idea of 18A process cost with it's gross margain report.
Jan 5, 2026
B
LEGO have just debut "Smart Brick"
INTEL can take a back seat , unless LEGO are using INTEL to fabricate their chips obviously
Jan 5, 2026
B
https://www.findarticles.com/lego-smart-brick-lights-like-a-tie-fighter-whooshes-like-a-saber/
Lego’s first-ever CES appearance brought...
Jan 5, 2026
A
Intel is laying down the iGPU guantlet in their slides:
"82% faster than AMD HX 370", while consuming less power: 45W vs 53W sustained...
Jan 5, 2026