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TSMC kicks off record $24bn advanced chip project

Daniel Nenni

Daniel Nenni

Admin
Staff member
TSMC kicks off a $24B advanced chip project to fend off rival Samsung.

  • Ground was broken today on the $17.2B 5nm advanced chip facility in southern Taiwan at an estimated cost of $24B
  • The record chip project should push TSMC to 5% to 10% growth in the coming years, according chairman Morris Chang
  • TSMC leads the global foundry market with 56% market share versus Samsung 8%
"The latest chip project is set to go into test pilot runs in 2019 and to churn out the world's most leading-edge 5-nanometer chips by 2020 ... We are also confident to roll out 3-nanometer chips some four years from now," says TSMC Chang.

https://asia.nikkei.com/Business/AC/TSMC-kicks-off-record-24bn-advanced-chip-project?page=1

View attachment 21046
 
Last edited:
More details from TSMC website:
Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
5nm production in 2020 after equipment move-in in 2019.

My thoughts:
Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.
 
benb said:
More details from TSMC website:
Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
5nm production in 2020 after equipment move-in in 2019.

My thoughts:
Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.
Click to expand...

Nope. TSMC will introduce EUV first. Customers have mentioned getting EUV at the contacts and vias at 7N before getting EUV for metals and shrink at 7N+. Samsung may have more EUV layers but TSMC will be first, absolutely. I will know more next week when I am in Hsinchu so stay tuned.
 
benb said:
More details from TSMC website:
Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
5nm production in 2020 after equipment move-in in 2019.

My thoughts:
Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.
Click to expand...

Both Intel and GF have EUV systems. GF has 2 being installed in Fab 8 now and 2 more due next year. Intel is rumored to have 8 EUV tools in Oregon presumably in D1X.
 
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