HSINCHU, Taiwan, R.O.C., Nov. 8, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today held a
meeting of the Board of Directors, which passed the following resolutions:
1. Approved the distribution of a NT$2.75 per share cash dividend for the third quarter of 2022,
and set March 22, 2023 as the record date for common stock shareholders entitled to participate
in this cash dividend distribution, and the ex-dividend date for the common shares shall be March
16, 2023.
As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall
be closed for five days prior to the record date (March 18 through March 22, 2023) for
registration transfer, and the dividend will be paid on April 13, 2023. In addition, the ex-dividend
date for TSMC American Depositary Shares (ADSs) will be March 16, 2023. The record date
for TSMC ADSs entitled to participate in this cash dividend distribution will be March 17, 2023.
2. Approved capital appropriations of approximately US$5,717.19 million for purposes including:
1) Installation and upgrade of advanced technology capacity;
2) Installation of specialty technology capacity;
3) Fab construction, and installation of fab facility systems;
4) 2023 R&D capital investments and sustaining capital expenditures;
5) 2023 capitalized leased assets.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been
the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s leading process technologies and
portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.
With global operations spanning Asia, Europe, and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535
customers in 2021 by providing broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the
most advanced semiconductor process technology available in the world. The Company is
headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
# # #
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-5636688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Baker Li
Public Relations
Tel: 886-3-5636688 ext.7125037
Mobile: 886-988-932-757
E-Mail: baker_li@tsmc.com
meeting of the Board of Directors, which passed the following resolutions:
1. Approved the distribution of a NT$2.75 per share cash dividend for the third quarter of 2022,
and set March 22, 2023 as the record date for common stock shareholders entitled to participate
in this cash dividend distribution, and the ex-dividend date for the common shares shall be March
16, 2023.
As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall
be closed for five days prior to the record date (March 18 through March 22, 2023) for
registration transfer, and the dividend will be paid on April 13, 2023. In addition, the ex-dividend
date for TSMC American Depositary Shares (ADSs) will be March 16, 2023. The record date
for TSMC ADSs entitled to participate in this cash dividend distribution will be March 17, 2023.
2. Approved capital appropriations of approximately US$5,717.19 million for purposes including:
1) Installation and upgrade of advanced technology capacity;
2) Installation of specialty technology capacity;
3) Fab construction, and installation of fab facility systems;
4) 2023 R&D capital investments and sustaining capital expenditures;
5) 2023 capitalized leased assets.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been
the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s leading process technologies and
portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.
With global operations spanning Asia, Europe, and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535
customers in 2021 by providing broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the
most advanced semiconductor process technology available in the world. The Company is
headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
# # #
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-5636688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Baker Li
Public Relations
Tel: 886-3-5636688 ext.7125037
Mobile: 886-988-932-757
E-Mail: baker_li@tsmc.com