Thermal dissipation is not something to be neglected even when using backside power metal. There can still be a significant thermal penalty with respect to FSPDN.
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Thermal impact from BSPDN
- Thread starter Fred Chen
- Start date
Thermal dissipation is not something to be neglected even when using backside power metal. There can still be a significant thermal penalty with respect to FSPDN.
MKWVentures
Moderator
TSMC and Intel looked at this and characterized it. They are also using the technology to provide options to improve heat dissipation in other ways.
Thermal dissipation is not something to be neglected even when using backside power metal. There can still be a significant thermal penalty with respect to FSPDN.