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As we are seeing a major technology shift in memory to phase change and 3dXpoint (similar to phase change), what are the communities thoughts as to the following options.
Stacking layers of standard technology
Stacking layers of 2d technology (this option seems the farthest out of standard technologies)
Stacking layers of SOI technology
Any other types of phase change technology on the horizon
Future optical options
I know this is a very broad range, but any input would be appreciated.
I vote for stacking layers of different technologies. Standard on SOI, 130nm on 45nm, DRAM process on high-speed process, etc. Incorporating disparate technology in a single 3D chip should be a game-changer.