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Silicon/package requalification

A

arijal

New member
Assuming that nothing changed neither in the manufacturing process nor in the silicon packaging, is there a need to perform a requalification process from time to time?
If positive, what are the time periods? Is it silicon node or package type dependent?
As far as I can see, according to JEDEC, it seems that requalification is needed when something in the design/process/packaging has changed.
Thank you!
 
My understanding is no. Maybe you might have to requal at different fabs (especially if the fab isn't copying the current fab you use exactly).
 
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