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Is this new 2D technology a major change in semis or just another tweak to existing fabrication systems? Any related observations on this and other companies working on this or using it would be appreciated. Thanks
Applied extends 2D EUV logic scaling with Stensar™ CVD alternative to spin-on patterning films Previews broadest portfolio of technologies for 3D Gate-All-Around transistors including two new IMS™ systems
They're targeting the layers right under the EUV resist layer as well as smoothing the EUV resist layer itself. It looks like they assume the continued use of organic chemically amplified resists, not the newer metal oxide resists.