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Micron's rushed sale of Lehi fab

F

Fred Chen

Moderator
Reading this, I got the impression that Micron tried to sell off its Lehi fab very quickly, and TI didn't even take all of it:
searchstorage.techtarget.com

Micron 3D XPoint supply will end with $900M fab sale to TI | TechTarget

Micron's 3D XPoint supplies to Intel will wind down with the $900 million sale of its Utah semiconductor factory to Texas Instruments at year's end.
searchstorage.techtarget.com searchstorage.techtarget.com

The 40% in "tools and assets" still yet to be disposed.
 
Last edited:
I'm not a memory person but with the current memory boom why isn't Micron doing better? Are they not competitive with Korea or China?
 
Daniel Nenni said:
I'm not a memory person but with the current memory boom why isn't Micron doing better? Are they not competitive with Korea or China?
Click to expand...
This particular fab was a remnant of Micron's collaboration with Intel, formerly IMFlash, which included development of 3D NAND (based on floating gate) and 3D XPoint. In the end, both development collaborations ended, at different times. This would amount to somewhat of a waste of time/resources for Micron. In particular, the 3D NAND developed with Intel got sold to SK Hynix, and Micron replaced it for itself with a different type of 3D NAND ("replacement gate"). The 3D XPoint got stopped at Micron completely. Micron probably made the last contracted Optane wafers for Intel, now that it has to deal with disposing the "tools and assets" after the fab sale.

In DRAM, Micron is doing much better. DRAM is having better business than NAND currently.
 
Fred Chen said:
This particular fab was a remnant of Micron's collaboration with Intel, formerly IMFlash, which included development of 3D NAND (based on floating gate) and 3D XPoint. In the end, both development collaborations ended, at different times. This would amount to somewhat of a waste of time/resources for Micron. In particular, the 3D NAND developed with Intel got sold to SK Hynix, and Micron replaced it for itself with a different type of 3D NAND ("replacement gate"). The 3D XPoint got stopped at Micron completely. Micron probably made the last contracted Optane wafers for Intel, now that it has to deal with disposing the "tools and assets" after the fab sale.

In DRAM, Micron is doing much better. DRAM is having better business than NAND currently.
Click to expand...
Hinyx though made such a good business with it
 
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