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Logic Contact from W to Mo, could be a key innovation for GAA from 1st generations to 2nd generations, "traditional tungsten contacts face challenges .. Molybdenum .. has emerged as a promising alternative .. adopted by leading logic chipmakers at 2nm and below process nodes", a press release by Applied Materials in conjunction with 2026-Feb-SemiconKorea, link = https://ir.appliedmaterials.com/new...als-unveils-transistor-and-wiring-innovations
. Applied says 50% resistance reduction with "an innovation at the Contact interface", of course, details were not revealed
. Applied says 15% resistance reduction with "switching from W to Mo"
. source = Applied Master Class on Logic, 2026-Apr-08, https://ir.appliedmaterials.com/events/event-details/2026-logic-master-class
Mike Chuczyk, vice president of technology at Applied Semiconductor, said at a press conference (in conjunction with 2026-Feb-SemiconKorea) announcing new products held at the Chosun Palace in Gangnam on the 12th, "The new spectral molybdenum ALD system (Spectral) has already been implemented in the first customer's 14A logic semiconductor process."
link = https://www.thelec.kr/news/articleView.html?idxno=52384