Intel’s 18A rumors meet a thermal brick wall says SemiWiki

[Xebec]

Yeah, physics is a pain, ain't it? ;-)

Hi Ian - What are your thoughts on this product/claim (how does this compare to other solutions being used today)?

Thermal pads with in-built vapor-chambers claim 50 to 80 times better thermal conductivity than normal thermal pads — 1,200 W/m-K "Vapor-Pad" from Xerendipity designed to replace traditional TIM in a CPU

The company also showed off a non-metal vapor chamber for phones.

www.tomshardware.com

In comes the Vapor-Pad, which is essentially a sticker with a thin vapor chamber on it, giving you the best of both worlds. Xerendipity claims its product can dissipate between 800–1,200 W/m-K of heat versus the 15 W/m-K that traditional thermal pads are capable of.

 

[IanD]

That helps with the thermal resistance from die to heatsink. It doesn't help with the increased BSPD thermal resistance, this is inside the chip.