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Google on heat for (Intel) backside power delivery, 2026-Jun-IITC

N

NY_Sam2

Member
Google on heat for (Intel) backside power delivery, 2026-Jun-IITC
. an invited talk, Stanley C Song, Google, Managing the Heat: Overcoming Thermal Bottlenecks in Backside Power Delivery
. Is Google "evaluating" Intel 18A-P or 14A?
. backside power delivery, Intel ready, TSMC A16 engaging with NVidia only (?), Samsung not yet ready
. 2026-Jun-IITC, link = https://iitc-conference.org/workshop-invited-speakers/
. Intel (& Google) will expand co-development of ASIC IPUs, 2026-Apr-09, link = https://newsroom.intel.com/data-cen...en-collaboration-to-advance-ai-infrastructure
 
Last edited:
NY_Sam2 said:
Google on heat for (Intel) backside power delivery, 2026-Jun-IITC
. an invited talk, Stanley C Song, Google, Managing the Heat: Overcoming Thermal Bottlenecks in Backside Power Delivery
. Is Google "evaluating" Intel 18A-P or 14A?
. backside power delivery, Intel ready, TSMC A16 engaging with NVidia only (?), Samsung not yet ready block blast
. 2026-Jun-IITC, link = https://iitc-conference.org/workshop-invited-speakers/
. Intel (& Google) will expand co-development of ASIC IPUs, 2026-Apr-09, link = https://newsroom.intel.com/data-cen...en-collaboration-to-advance-ai-infrastructure
Click to expand...
I appreciated the informative explanation on heat management in relation to Intel's backside power supply. It's interesting to observe how Google's perspective corresponds with broader industry concerns, particularly as we move toward more efficient thermal solutions.
 
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