Elon Musk throws shade on ASML's High-NA EUV machines

[Fred Chen]

"Half the chip for twice as much, for a gain that is relatively small."

 

[Fred Chen]

He did not specify in the clip why China will come out winning in the end (more power than anyone else, probably have more chips), maybe there were was something mentioned earlier.

 

[hist78]

He did not specify in the clip why China will come out winning in the end (more power than anyone else, probably have more chips), maybe there were was something mentioned earlier.

During TSMC's recent annual shareholders meeting, in response to a shareholder's question about whether TSMC was making a mistake by not purchasing High-NA EUV tools, CEO C. C. Wei said that TSMC had in fact purchased High-NA EUV systems, although he declined to reveal the total number acquired.

Mr. Wei also said that the current challenge is that High-NA EUV throughput is not yet sufficient. He added that TSMC is working hard to improve its productivity.

 

[Fred Chen]

Mr. Wei also said that the current challenge is that High-NA EUV throughput is not yet sufficient. He added that TSMC is working hard to improve its productivity.

It could be the half-field size, or it could be directly exposing a smaller pitch (the resist).

 

[hist78]

It could be the half-field size, or it could be directly exposing a smaller pitch (the resist).

Will Intel handle it differently?

Also, how will TSMC deal with the multi-patterning issues and higher cost when A14 arrives using existing EUV tools?

 

[Barnsley]

"Half the chip for twice as much, for a gain that is relatively small."

Are folk not bored of his utterings yet?

 

[Fred Chen]

Are folk not bored of his utterings yet?

Again, the clip does not provide the context of these comments. How this came up could be pretty interesting.

 

[Fred Chen]

Will Intel handle it differently?

Most likely Intel will be forced to follow same path as TSMC. It had no 14A customers at the beginning of the year: https://www.tomshardware.com/tech-i...hear-about-commitments-in-second-half-of-2026. Terafab was the big 14A endorser in April. Tesla's AI5 is 645 mm2, so it would need stitching on the High-NA tool. This is where EM's comments on "half a chip for twice the cost" may be relevant.

Also, how will TSMC deal with the multi-patterning issues and higher cost when A14 arrives using existing EUV tools?

With multipatterning, you're talking about EUV double patterning or DUV quad patterning. The latter is actually much cheaper.