Google's next TPU may have become the most important packaging battleground in AI.
After Intel unexpectedly won Google's next-generation TPU packaging business with EMIB-T, TSMC appeared to be on the defensive. But as concerns grow over yield, reliability, and manufacturing readiness, industry sources say the story may not be over.
Could Google's next TPU shift back to TSMC?
This isn't just a fight between Intel and TSMC. It's a high-stakes test of whether EMIB can emerge as a credible alternative to CoWoS—and whether Google's AI infrastructure roadmap could ultimately reshape the balance of power across the semiconductor industry.
cwnewsroom.substack.com
After Intel unexpectedly won Google's next-generation TPU packaging business with EMIB-T, TSMC appeared to be on the defensive. But as concerns grow over yield, reliability, and manufacturing readiness, industry sources say the story may not be over.
Could Google's next TPU shift back to TSMC?
This isn't just a fight between Intel and TSMC. It's a high-stakes test of whether EMIB can emerge as a credible alternative to CoWoS—and whether Google's AI infrastructure roadmap could ultimately reshape the balance of power across the semiconductor industry.
Could Google's Next TPU Shift Back to TSMC? Inside the EMIB vs. CoWoS Battle
Liang-rong Chen
cwnewsroom.substack.com
