Call for Papers 17th ISQED - March 16-18, 2015, Santa Clara, California

[Daniel Nenni]

A pioneer and leading interdisciplinary conference, the 17th International Symposium on Quality Electronic Design (ISQED2015) accepts and promotes original and unpublished papers related to the IC and System Design, Semiconductor Technology, Advanced IC Packaging, Test, and Design Automation. Authors are invited to submit papers in following topics:

• Electronic Design
  1. IOT & Smart Sensors Design and Technology
  2. Hardware and System Security
  3. System-level Design, Methodologies & Tools
  4. FPGA Architecture, Design, and CAD
  5. IC Package - Design Interactions & Co-Design
  6. Advanced 3D ICs & 3D Packaging
  7. Robust & Power-conscious Circuits & Systems
  8. Emerging/Innovative Process & Device Technologies and Design Issues
  9. Design of Reliable Circuits and Systems
  10. Design of Embedded Systems
• Design Automation and IP
  1. IP Design, quality, interoperability and reuse
  2. Design Verification and Design for Testability
  3. Physical Design, Methodologies & Tools
  4. EDA Methodologies, Tools, Flows
• Manufacturing, Semiconductor Process and Devices
  1. Design for Manufacturability/Yield & Quality
  2. IC and package level Reliability, Qualification, and Yield

Past ISQED papers have been published in IEEE Xplore and ISQED proceedings and indexed in Scopus. For information about paper submission, as well as how to submit tutorial proposals, and sponsorship requests please visit the conference website.

Co-located Conferences

• Senosrs & IOT- Technology,Design, Application & Market Conference (SensorsCon)

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