Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/threads/broadcom-expects-to-sell-1-million-3d-stacked-chips-by-2027.24618/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2030970
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

Broadcom expects to sell 1 million 3D stacked chips by 2027

user nl

Well-known member
https://finance.yahoo.com/news/exclusive-broadcom-expects-sell-1-140222326.html

By Max A. Cherney

SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an ‌executive told Reuters on Wednesday.

The forecast, which Reuters is the first to report, marks a new product ‌and sales target for Broadcom that could represent a revenue stream potentially worth billions of dollars.


https://www.broadcom.com/info/ai/3point5d
 
"Artificial Intelligence chip designer Broadcom..." - that's funny. Maybe "Artificial Intelligence circuit and packaging designer Broadcom...". The Broadcom announcement is better than the Reuters article, but even Broadcom gets carried away. They tout their network I/O IP, but on their most famous "product", the Google TPU, the network I/O is all proprietary to Google.
 
Back
Top