Broadcom expects to sell 1 million 3D stacked chips by 2027

[user nl]

SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an ‌executive told Reuters on Wednesday.

The forecast, which Reuters is the first to report, marks a new product ‌and sales target for Broadcom that could represent a revenue stream potentially worth billions of dollars.

Harish Bharadwaj, vice president of product marketing, said the 1 million chips the company projects it will sell are based on an approach Broadcom developed that stacks two chips on top of one another, allowing the distinct pieces of silicon to be tightly bound to improve the speed at which data can flow from one chip to another.

https://finance.yahoo.com/news/exclusive-broadcom-expects-sell-1-140222326.html

https://www.broadcom.com/info/ai/3point5d

 

[blueone]

"Artificial Intelligence chip designer Broadcom..." - that's funny. Maybe "Artificial Intelligence circuit and packaging designer Broadcom...". The Broadcom announcement is better than the Reuters article, but even Broadcom gets carried away. They tout their network I/O IP, but on their most famous "product", the Google TPU, the network I/O is all proprietary to Google.