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TAIPEI (Reuters) -Arizona is in talks with Taiwanese chipmaker TSMC on advanced packaging, Governor Katie Hobbs said on Tuesday, as the U.S. state seeks to attract more investment and address challenges that TSMC's massive project has encountered there. TSMC is investing $40 billion to build...
For TSMC it's not a bad idea to have the advanced packaging capability in the US. Although the skilled labor shortages and high cost are still challenging.
The problem is that packaging is not a high margin business to start with which is why most of it is off shore. I'm not convinced this is going to work unless AZ puts up some serious money.
I'm trying to remember if there is a modern packaging facility in the US? Has the Intel New Mexico site been upgraded? They were down to 14nm last I heard.
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude...
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I have a follow-up conversation with Intel coming up, I will ask.
