You heard it here first: AMD $AMD is planning to use Intel $INTC foundry to manufacture chips in the USA (not just packaging). During my job listing research, I uncovered a job listing posted by AMD that mentions Intel’s “PowerVia” under preferred experience… This is HUGE!
https://x.com/christophauto
chris @christophauto
(PowerVia is Intel's groundbreaking backside power delivery technology, a chipmaking innovation that moves power and ground connections to the back of the chip, separating them from data signals for better performance, efficiency, and density, debuting in Intel 20A and optimized for 18A. It's a key part of Intel's strategy to regain process leadership, working with their new RibbonFET transistors.)
https://x.com/christophauto
chris @christophauto
(PowerVia is Intel's groundbreaking backside power delivery technology, a chipmaking innovation that moves power and ground connections to the back of the chip, separating them from data signals for better performance, efficiency, and density, debuting in Intel 20A and optimized for 18A. It's a key part of Intel's strategy to regain process leadership, working with their new RibbonFET transistors.)