Limited Free Tickets, Register NOW for Free Ticket!
-->Free Tickets Sold Out, please use Code "CASPA_semiwiki_2018" to have 100% discount for Last Call tickets.
https://caspa-2018-spring-symposium..../?aff=semiwiki
View attachment 21246
AI and Semiconductor Fusion - Part II Go Deep
Artificial Intelligence (AI) has seen resurgence in recent years fueled by the advance in computational power, algorithms and large amount of data, which are propelled by the semiconductor chip technology. AI technology in turns creates new demand for semiconductor industry. The theme of the symposium will be "AI and Semiconductor Fusion". This term was coined by CASPA in 2017 Annual Conference and become instantly popular among Semiconductor professionals and general tech audiences. We have historically high attendance in our annual conference. The 2018 spring symposium will go deeper on this theme with focus on the following areas:
(1). Deep learning applications and semiconductor solutions
(2). Enabling memory and computation technology for AI
Venue: Intel SC12 Auditorium, 3600 Juliette Ln, Santa Clara, CA 95054
Date: Saturday, March 3, 2018, 12pm – 5pm.
Agenda:
12:00 – 1:00pm Registration & Networking
1:00 – 1:05pm Symposium Opening Remarks
Richard Yang, Ph.D., Executive Director of Symposium, CASPA
1:05 – 1:15pm Welcome from CASPA President
Brandon Wang, President, CASPA
1:15 – 1:45pm FPGA Solutions for Artificial Intelligence and Machine Learning
Vincent Hu, VP Strategy Innovation and Planning, Programmable Solutions Group, Intel
1:45 – 2:15pm Enhancing and Augmenting Human Perception and Health with Advanced Sensors and Artificial Intelligence
Achin Bhowmik, Ph.D. chief technology officer and executive vice president of engineering. Starkey Hearing Technologies
2:15 – 2:45pm Future Computing and Hardware
Jeffery Welser, Ph.D., VP and Lab Director, IBM Research, Almaden
2:45 – 3:00pm Break
3:00 – 3:30pm Unleashing Intelligence and Data Insights at Scale
Wei Li, VP, Software and Services Group, General Manager of Machine Learning and Translation, Intel
3:30 – 4:00pm AI Trends and the Impact on Memory Systems
Steven Woo, Ph.D., VP and Distinguished Inventor, Systems and Solutions
Rambus Inc.
4:00 – 4:20pm Is It Time to Build Security in AI Chips?
Lan Jenson, CEO, Adaptable Security Corp.
4:20 – 4:40pm Enabling 10,000 Custom AI Chips at Scale with RISC-V
Yunsup Lee, CTO and Co-Founder, SiFive
4:40 – 5:00pm Closing Remark and Prize Drawing
-->Free Tickets Sold Out, please use Code "CASPA_semiwiki_2018" to have 100% discount for Last Call tickets.
https://caspa-2018-spring-symposium..../?aff=semiwiki
View attachment 21246
AI and Semiconductor Fusion - Part II Go Deep
Artificial Intelligence (AI) has seen resurgence in recent years fueled by the advance in computational power, algorithms and large amount of data, which are propelled by the semiconductor chip technology. AI technology in turns creates new demand for semiconductor industry. The theme of the symposium will be "AI and Semiconductor Fusion". This term was coined by CASPA in 2017 Annual Conference and become instantly popular among Semiconductor professionals and general tech audiences. We have historically high attendance in our annual conference. The 2018 spring symposium will go deeper on this theme with focus on the following areas:
(1). Deep learning applications and semiconductor solutions
(2). Enabling memory and computation technology for AI
Venue: Intel SC12 Auditorium, 3600 Juliette Ln, Santa Clara, CA 95054
Date: Saturday, March 3, 2018, 12pm – 5pm.
Agenda:
12:00 – 1:00pm Registration & Networking
1:00 – 1:05pm Symposium Opening Remarks
Richard Yang, Ph.D., Executive Director of Symposium, CASPA
1:05 – 1:15pm Welcome from CASPA President
Brandon Wang, President, CASPA
1:15 – 1:45pm FPGA Solutions for Artificial Intelligence and Machine Learning
Vincent Hu, VP Strategy Innovation and Planning, Programmable Solutions Group, Intel
1:45 – 2:15pm Enhancing and Augmenting Human Perception and Health with Advanced Sensors and Artificial Intelligence
Achin Bhowmik, Ph.D. chief technology officer and executive vice president of engineering. Starkey Hearing Technologies
2:15 – 2:45pm Future Computing and Hardware
Jeffery Welser, Ph.D., VP and Lab Director, IBM Research, Almaden
2:45 – 3:00pm Break
3:00 – 3:30pm Unleashing Intelligence and Data Insights at Scale
Wei Li, VP, Software and Services Group, General Manager of Machine Learning and Translation, Intel
3:30 – 4:00pm AI Trends and the Impact on Memory Systems
Steven Woo, Ph.D., VP and Distinguished Inventor, Systems and Solutions
Rambus Inc.
4:00 – 4:20pm Is It Time to Build Security in AI Chips?
Lan Jenson, CEO, Adaptable Security Corp.
4:20 – 4:40pm Enabling 10,000 Custom AI Chips at Scale with RISC-V
Yunsup Lee, CTO and Co-Founder, SiFive
4:40 – 5:00pm Closing Remark and Prize Drawing
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