SK Hynix is drawing attention for seeking cooperation with Intel in the field of cutting-edge packaging. It is understood that the company is currently conducting tests to integrate High Bandwidth Memory (HBM) and system semiconductors by adopting 2.5D packaging technology from Intel.
As TSMC, a leader in the 2.5D packaging industry, has recently been experiencing severe supply shortages, expectations are rising that the supply chain for 2.5D packaging for AI accelerators could be diversified.
According to industry sources on the 11th, SK Hynix is conducting research and development (R&D) on 2.5D packaging technology with Intel.
SK Hynix's HBM4 product (Photo = SK Hynix)
2.5D packaging is a technology that improves chip performance by inserting a thin film-type interposer between a semiconductor and a substrate . A representative application is AI accelerators developed by global big tech companies such as NVIDIA and AMD. AI accelerators are created by combining various high-performance system semiconductors, such as GPUs, with HBM using 2.5D packaging.
Currently, the 2.5D packaging supply chain for global big tech is virtually monopolized by TSMC, a major Taiwanese foundry. SK Hynix has also maintained a close cooperative relationship with TSMC and has been conducting joint research and development related to HBM and 2.5D packaging.
Furthermore, SK Hynix is considering adopting Intel's 2.5D packaging technology, 'Embedded Multi-Die Interconnect Bridge (EMIB).' It is understood that the company is currently conducting tests to combine HBM and system semiconductors using EMIB-embedded substrates supplied by Intel.
"Although it is still in the early stages of research and development, SK Hynix is actively conducting tests to implement 2.5D packaging with Intel EMIB," a source said. "They are also looking for candidates for materials and components needed for actual mass production."
The discussions regarding cooperation between SK Hynix and Intel are interpreted as a result of the two companies' interests aligning well.
TSMC's 2.5D packaging technology, 'Chip-on-Wafer-on-Substrate (CoWoS),' is currently facing severe supply shortages due to the recent boom in AI semiconductors. Consequently, several big tech companies are looking to Intel EMIB as a promising alternative to CoWoS.
From SK Hynix's perspective, proactive research and development regarding Intel EMIB is also necessary. Although SK Hynix does not directly mass-produce 2.5D packaging, developing HBM while considering the structure and characteristics of 2.5D packaging is advantageous for improving yield and stability. In fact, SK Hynix is operating a small-scale line in Korea for the research and development of 2.5D packaging.
In addition, through the collaboration between the two companies, Intel is expected to significantly expand its cutting-edge packaging business. Intel EMIB connects chips using small silicon bridges instead of wide interposers . Since bridges only need to be placed where connections between chips are required, chips can be positioned more flexibly and efficiently.
"Intel is currently actively promoting EMIB technology to SK Hynix and major OSATs," a semiconductor industry official explained. "In the mid-to-long term, Intel EMIB is expected to be added to the 2.5D packaging supply chain for AI accelerators."
zdnet.co.kr
As TSMC, a leader in the 2.5D packaging industry, has recently been experiencing severe supply shortages, expectations are rising that the supply chain for 2.5D packaging for AI accelerators could be diversified.
According to industry sources on the 11th, SK Hynix is conducting research and development (R&D) on 2.5D packaging technology with Intel.
SK Hynix's HBM4 product (Photo = SK Hynix)
2.5D packaging is a technology that improves chip performance by inserting a thin film-type interposer between a semiconductor and a substrate . A representative application is AI accelerators developed by global big tech companies such as NVIDIA and AMD. AI accelerators are created by combining various high-performance system semiconductors, such as GPUs, with HBM using 2.5D packaging.
Currently, the 2.5D packaging supply chain for global big tech is virtually monopolized by TSMC, a major Taiwanese foundry. SK Hynix has also maintained a close cooperative relationship with TSMC and has been conducting joint research and development related to HBM and 2.5D packaging.
Furthermore, SK Hynix is considering adopting Intel's 2.5D packaging technology, 'Embedded Multi-Die Interconnect Bridge (EMIB).' It is understood that the company is currently conducting tests to combine HBM and system semiconductors using EMIB-embedded substrates supplied by Intel.
"Although it is still in the early stages of research and development, SK Hynix is actively conducting tests to implement 2.5D packaging with Intel EMIB," a source said. "They are also looking for candidates for materials and components needed for actual mass production."
The discussions regarding cooperation between SK Hynix and Intel are interpreted as a result of the two companies' interests aligning well.
TSMC's 2.5D packaging technology, 'Chip-on-Wafer-on-Substrate (CoWoS),' is currently facing severe supply shortages due to the recent boom in AI semiconductors. Consequently, several big tech companies are looking to Intel EMIB as a promising alternative to CoWoS.
From SK Hynix's perspective, proactive research and development regarding Intel EMIB is also necessary. Although SK Hynix does not directly mass-produce 2.5D packaging, developing HBM while considering the structure and characteristics of 2.5D packaging is advantageous for improving yield and stability. In fact, SK Hynix is operating a small-scale line in Korea for the research and development of 2.5D packaging.
In addition, through the collaboration between the two companies, Intel is expected to significantly expand its cutting-edge packaging business. Intel EMIB connects chips using small silicon bridges instead of wide interposers . Since bridges only need to be placed where connections between chips are required, chips can be positioned more flexibly and efficiently.
"Intel is currently actively promoting EMIB technology to SK Hynix and major OSATs," a semiconductor industry official explained. "In the mid-to-long term, Intel EMIB is expected to be added to the 2.5D packaging supply chain for AI accelerators."
SK하이닉스, 인텔과 2.5D 패키징 협력 추진…AI칩 공급망 변동 예고
SK하이닉스가 인텔과 최첨단 패키징 분야에서 협력 도모에 나서 주목된다. 현재 인텔로부터 2.5D 패키징 기술을 도입해 고대역폭메모리(HBM) 및 시스템반도체를 집적하는 테스트를 진행 중인 것으로 파악됐다.2.5D 패키징 업계 선두주자인 대만 TSMC가 최근 극심한 공급난을 겪는 가운데, ...