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Intel Reports First-Quarter 2026 Financial Results
News Summary - First-quarter revenue was $13.6 billion, up 7% year-over-year (YoY). - First-quarter earnings (loss) per share (EPS) attributable to Intel was $(0.73); non-GAAP EPS attributable to Intel was $0.29. - Forecasting second-quarter 2026 revenue of $13.8 billion to $14.8 billion...- AmandaK
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- Forum: Intel Foundry
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Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset
LPDDR-based SOCAMM2 chipset, including new Voltage Regulators and SPD Hub, supports AI data center performance scaling in a low-power, high-bandwidth, compact module form factor - First in a planned family of LPDDR-based server module chipsets for future AI systems - Enables low-power... -
TSMC Debuts A13 Technology at 2026 North America Technology Symposium
Newest Node Pushes Density Scaling and Energy Efficiency to New Heights to Address Industry’s Most Demanding Applications SANTA CLARA, CA, Apr. 22, 2026 -- TSMC (TWSE: 2330, NYSE: TSM) today debuted its latest innovation in its most advanced process technology at the Company’s 2026 North... -
TSMC Files Annual Report on Form 20-F for 2025
HSINCHU, Taiwan, R.O.C. – Apr. 16, 2026 - TSMC (TWSE: 2330, NYSE: TSM) today filed its 2025 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free... -
TSMC Reports First Quarter EPS of NT$22.08
HSINCHU, Taiwan, R.O.C., Apr. 16, 2026 -- TSMC (TWSE: 2330, NYSE: TSM) today announced consolidated revenue of NT$1,134.10 billion, net income of NT$572.48 billion, and diluted earnings per share of NT$22.08 (US$3.49 per ADR unit) for the first quarter ended March 31, 2026. Year-over-year... -
Siemens collaborates with TSMC to advance AI for semiconductor design
April 22, 2026 Plano, Texas, USA Siemens and TSMC are collaborating to drive innovation in AI powered‑ automation and advanced semiconductor design enablement (Image courtesy of Taiwan Semiconductor Manufacturing Co., Ltd.) - Siemens collaborates with TSMC to advance AI-powered automation...- AmandaK
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- Forum: Siemens EDA
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Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows
AI-powered digital, analog and verification flows and broad IP solutions deliver exceptional quality of results for TSMC advanced technologies - Successful silicon bring-up of industry's first low-power M-PHY v6.0 IP on TSMC N2P, tape-out of 64G UCIe IP, and 224G IP speeds development of... -
Silvaco Partners with ITRI to Support MCU Development and Startup Innovation
SmartSpice™ Adoption Agreement to Enable Next-Generation Microcontroller Unit Development SANTA CLARA, Calif., April 20, 2026 (GLOBE NEWSWIRE) -- Silvaco Group, Inc. (Nasdaq: SVCO, "Silvaco"), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin... -
Siemens to invest 1.3 billion pesos to expand its production capacity in Querétaro
April 21, 2026 Hannover, Germany Siemens announced an investment of more than 1.3 billion pesos to expand its operations in the state of Querétaro, with the aim of increasing its production capacity and creating approximately 300 new jobs. The announcement was made at Hannover Messe, the...- AmandaK
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- Forum: Siemens EDA
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Siemens launches groundbreaking portfolio for the era of direct current technology
April 15, 2026 Warszawa, Poland SENTRON 3QD2 semiconductor circuit breaker Rising energy costs, pressure to improve efficiency, and the dynamic development of renewable sources are driving industry to take a closer look at direct current (DC) technologies. Siemens is responding to these needs...- AmandaK
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- Forum: Siemens EDA
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On Quantum Timelines: What Does “2029” Actually Mean?
Both Google and Cloudflare have announced that they are targeting 2029 to complete their post-quantum transitions, including post-quantum authentication. This is more aggressive than NIST’s 2030 deprecation timeline and the US government’s 2030–2035 targets. The acceleration follows the recent... -
Ceva, Inc. Announces Retirement of Long-Serving Board Member Sven-Christer Nilsson
ROCKVILLE, Md., April 20, 2026 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that Sven-Christer Nilsson will retire from its Board of Directors and will not seek re-election at the Company’s upcoming annual meeting... -
Universal Browser Support for JPEG XL: Is Your Hardware Ready for the New Standard?
04/10/2026 - 06:22 With the release of Chrome 145, the digital imaging industry has reached a pivotal milestone: universal native support for JPEG XL (jxl) across all major web browsers. By integrating a high-performance, Rust-based decoder, Google has aligned Chrome and Chromium-based browsers... -
yieldWerx and Enlight Technology Extend Design-to-Test Data Continuity Across Taiwan's Semiconductor Ecosystem
HSINCHU, Taiwan, April 21, 2026 /PRNewswire/ -- yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most concentrated semiconductor markets. yieldWerx... -
Arteris and MIPS Partner to Accelerate Development for Physical AI Platforms
Arteris FlexGen network-on-chip (NoC) IP and Magillem software solutions enable rapid development of MIPS-based high-performance, RISC-V platforms spanning automotive, embedded, and robotics markets. CAMPBELL, Calif. – April 21, 2026 — Arteris, Inc. (Nasdaq: AIP), a leading provider of... -
AI Processors Shift to System-Level Design with Alchip’s 3DIC Platform
Flexible chiplet architectures and advanced packaging support efficient development of next-generation AI processors Apr 17, 2026 Taipei, Taiwan As AI processor design shifts to systems level, Alchip Technologies says its 3DIC platform is driving more efficient development of next-generation... -
Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums
Analog Bits continues to develop innovative mixed signal IP in TSMC N2P process technology, with integrated LDOs, pinless remote PVT sensors, and microwatt class and high-performance LC PLLs Sunnyvale, CA, April 15, 2026 – Analog Bits (www.analogbits.com), developer of industry leading...- AmandaK
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- Forum: Analog Bits
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Siemens powers DrinkPAK’s expansion with advanced automation and digital technologies
April 14, 2026 Washington, D.C., USA - Siemens manufacturing and infrastructure technologies, coupled with financial services, optimize DrinkPAK’s Fort Worth facility operations Siemens is collaborating with DrinkPAK, one of North America’s largest canned beverage manufacturers, to automate...- AmandaK
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- Forum: Siemens EDA
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Perforce’s 2026 PHP Landscape Report Highlights a Growing Skills Gap with PHP
PHP continues to be a popular open source language for web applications and APIs, but fewer early-stage developers have PHP knowledge. MINNEAPOLIS, APRIL 14, 2026 — Perforce Software, the modern DevOps Tech Stack that ensures AI governance, announced the release of the 2026 PHP Landscape... -
DVCon Europe Announces 2026 Conference and Call For Papers Deadlines
Munich, Germany – 15th April 2026 - The Design and Verification Conference & Exhibition Europe (DVCon Europe), hosted by Accellera Systems Initiative, has announced the 13th edition of the show, to take place in Munich from 17th and 18th November. The Call for Papers has been issued and the...- AmandaK
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- Forum: General Press