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Search results

  1. F

    Samsung GAA SF2, Exynos 2600, cross-section images

    It looks like their "M0" shows 6 tracks (4 signal lines + 2 rails): So if it's 168 nm cell height, the M0 is actually 28 nm pitch.
  2. F

    Inside Nanya Technology’s Turnaround: Why Global Memory Giants Are Buying In

    Nanya licensed 1x and 1y from Micron: https://investors.micron.com/news-releases/news-release-details/micron-technology-license-1x-and-1y-dram-technologies-nanya Disappointingly, Nanya decided to play a node naming game, calling its latest node "1B" when it is actually closer to CXMT G3 (~1x)...
  3. F

    Logic Contact from W to Mo, a press release by Applied Materials

    Isn't the key motivation that Mo doesn't need a barrier liner, so it could fill more of the smaller contact?
  4. F

    Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

    It shouldn't make much difference, the pitch determines the resist thickness, which determines how many photons absorbed. This is the latest study of 36 L/S nm pitch by Samsung: https://www.nature.com/articles/s41598-025-29021-2
  5. F

    Samsung and SK are expanding fast, but why is memory still in short supply?

    I had gathered from TechInsights that the array area efficiency was just over 50% for 1b (LP)/DDR5, but also from them I only have one data point for HBM3 (1z), the array area efficiency was just under 50%.
  6. F

    Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

    The baseline defectivity is high even for a 40 nm pitch: Since it fluctuates, you can have very good yield at times, very bad also. Stochastics hasn't been truly solved, accepted perhaps.
  7. F

    Samsung and SK are expanding fast, but why is memory still in short supply?

    Not many HBM teardowns available but I had taken recent die area efficiency for the array ~50%, with TSVs ~10% (a strip down the middle). I might be over-generalizing though.
  8. F

    Samsung and SK are expanding fast, but why is memory still in short supply?

    Yes, the HBM TSVs have a keep-out-zone which will still take up a "small" % of the area.
  9. F

    Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

    36 nm pitch has significant stochastic defectivity, which has been reported by Samsung and others (first by IMEC). Samsung also confirmed the issue here as well...
  10. F

    Samsung and SK are expanding fast, but why is memory still in short supply?

    https://finance.yahoo.com/markets/stocks/articles/micron-hbm4-sold-turboquant-questions-014908722.html
  11. F

    SK Hynix to buy $8 billion in ASML chipmaking tools in largest disclosed order

    Interesting details from this disclosure: https://frederickchen.substack.com/p/estimating-euv-production-wafer-throughput
  12. F

    Samsung and SK are expanding fast, but why is memory still in short supply?

    The author likely only had info from her domestic sources. But the story is incomplete without Micron and how much it could produce. Presumably a similar story.
  13. F

    Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

    The large swings of yield can come from the intrinsic variation of stochastic defect density, but other systematic factors related to process control can also be contributing, perhaps comparably.
  14. F

    Samsung GAA SF2, Exynos 2600, cross-section images

    2nm track pitch ~ 23 nm, going by this: https://gamma0burst.tistory.com/413218#google_vignette
  15. F

    Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

    By Anton Shilov published March 5, 2026 But Intel is not out of the woods with its 18A node. When Lip-Bu Tan came to Intel last year, he considered stopping the promotion of the company's 18A (1.8nm-class) fabrication technology among potential external customers and making it yet another...
  16. F

    Terafab 21 March 2026

    It has some elements of putting everything in one basket, one location. Watch out for Austin hailstorms!
  17. F

    Inside Nanya Technology’s Turnaround: Why Global Memory Giants Are Buying In

    The named companies are SSD makers (even Cisco) who need DRAM (maybe even DDR5) as a cache component.
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