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Yes, a 32 nm pitch direct EUV print is highly risky and ppm-level defect probabilities have already been reported in several published sources (besides myself, Samsung/ASML and imec/Siemens) for 40 nm pitch and below. Probably even more difficult is the wide range (over an order of magnitude) of...
Ok, I'm not sure if the author is doing solely a speculative analysis or has the teardown. Author mentions five M0 tracks, but the cell height is determined by six 38 nm pitch M2 tracks (=228 nm).
I had the understanding that TechInsights did the analysis for this, so I'm not sure if that is...
A zoom-in on the slide confirms this picture as well: https://www.techpowerup.com/345929/intel-and-softbank-subsidiary-saimemory-partner-on-next-gen-z-angle-memory#g345929-2
This picture is more accurate than all those ridiculous AI-generated art with diagonals.
The idea is to have more DRAM dies stacked laterally on their sides. The interconnects between the dies are part of the package rather than going through the dies.
The referred Intel patent application is...
Feb 10, 2026 at 11:18am EST
China's CXMT is expanding its presence in the HBM market, aiming to capitalize on the AI frenzy, as the company is now reported to be converting a large chunk of its DRAM output.
CXMT's Capacity Shift Towards HBM Does Put the Idea of "Cheaper" Consumer Memory Under...
PC makers are getting desperate for memory chips.
The ongoing memory chip shortage is forcing leading PC makers to consider sources outside of the traditional big three suppliers — Micron, Samsung, and SK hynix. According to Nikkei, sources say that Dell and HP have started qualifying DRAM from...
Intel did not release any schematics, and there are plenty of AI-generated pictures around :ROFLMAO:
But from this graphic, it looks like combining vertically stacked DRAM dies and EMIB.
2026/02/04 13:11:08
Economic Daily reporter Cui Xinfang/instant report
In response to recent media reports pointing out that Changxin Storage (CXMT) sells DDR4 at a much lower price than the market price, raising market doubts about the price trend of the old generation memory, and the market...
Almost certainly, all of it is going to domestic customers, and it's likely not enough to go around even there. But in the outside chance it does go to US, we'll have to see what mood Trump is in.
2026-01-21 Henrik Bork
For the construction of AI data centers, so many DRAM memory chips are needed worldwide that there are no longer enough left for manufacturers of smartphones and computers. The current situation gives Chinese manufacturers like CXMT a boost.
The demand for memory chips...
The Tongluo fab is not DRAM: https://evertiq.com/news/55663
PSMC started construction of the USD 9.72 billion fab in 2021 in order to ramp up its output of mature chips with 28-nanometer, 45-nanometer and 50-nanometer technologies. The fab capacity is scheduled at 50,000 12-inch wafers per...
This statement is telling:
"The feedback from our colleagues, our suppliers and our customers shows that our ways of working have, in some cases, become less agile. Engineers in particular have expressed their desire to focus their time on engineering, without being hampered by slow process...
A Photomask Japan 2025 paper by Intel's Mask group pointed out that High-NA would bring more sensitivity to smaller defects, creating new challenges for detection and repair. In particular,
"High-NA EUV reticle repair has been challenging due to more precise edge control requirements...
By Anton Shilov published January 23, 2026
Intel still has zero committed external customers for 14A.
Two potential customers are currently exploring test chips made on Intel's 14A fabrication process, Intel disclosed as part of its earnings call this week.
The company said that there will be...
