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  1. F

    SK hynix completes Wuxi 1a DRAM conversion

    However they wanna do it, maybe finish the capacitor, then stop and pull the wafers out. Strictly speaking, the Wuxi fab would only have a partial conversion.
  2. F

    SK hynix completes Wuxi 1a DRAM conversion

    Packaging at a different location is normal, but separated FEOL and BEOL is not, if you're doing HVM.
  3. F

    SK hynix completes Wuxi 1a DRAM conversion

    The shipping of wafers to China is an interruption in an otherwise smooth flow; it would be much easier for them to have a non-EUV flow all in China.
  4. F

    SK hynix completes Wuxi 1a DRAM conversion

    Date : 2026-01-14 14:14 Page : 2026-01-15 SK hynix has upgraded its Wuxi plant (fab) in China, a key base for DRAM production. It is evaluated that the process conversion has been completed amid US public semiconductor sanctions and the production base has been expanded. According to the...
  5. F

    Lip-Bu Tan Update on 18A and 14A

    10nm failure was cobalt, that's why it was walked back in subsequent nodes.
  6. F

    Lip-Bu Tan Update on 18A and 14A

    Intel's current capital expenditure (CapEx) plan does not include investments in 14A capacity for third-party clients. Hence, even if Intel lands an order from a major customer (think Apple, AMD, Nvidia, or Qualcomm), it will have to invest in additional capacity, which will delay Intel Foundry...
  7. F

    HP qualifying CXMT and other Chinese memory suppliers due to ongoing DRAM shortage

    HBM consumes most of the DRAM but is the AI priority, then you have the LTAs, but even the latter may be vulnerable, as indicated in the article. So PC vendors are looking for alternative LTAs.
  8. F

    HP qualifying CXMT and other Chinese memory suppliers due to ongoing DRAM shortage

    AI has created the DRAM shortage which the big suppliers happily exploit: https://wccftech.com/memory-suppliers-are-now-cherry-picking-customers/ "The ongoing DRAM supercycle has made suppliers the "king of the jungle", since the industry is now a seller's market, according to a report by...
  9. F

    HP qualifying CXMT and other Chinese memory suppliers due to ongoing DRAM shortage

    HP Is Reportedly Left With Limited Choices but to Turn to Chinese Memory Suppliers Like CXMT to Combat DRAM Shortages One of the largest PC manufacturers, HP, may look to Chinese memory suppliers to secure its DRAM supply, as all other options appear to be exhausted for now. China's CXMT Could...
  10. F

    Exclusive: Jensen Huang’s Remark Sparks Storage Rally—Phison CEO Responds from CES

    It looks like the context is AI SSDs: https://blocksandfiles.com/2026/01/06/nvidia-standardizes-gpu-cluster-kv-cache-offload-to-nvme-ssds/ I don't see any mention of HBF, although reportedly he was working with Kioxia and SK hynix on that.
  11. F

    Musk: "They're getting clean rooms wrong in these modern (chip) fabs"

    Humidity and temperature are important for the litho bays. So at least keep the smoking and dining rooms separate from those.
  12. F

    CES 2026: Intel Core Ultra Series 3 Debuts as First Built on Intel 18A

    It's been known that Intel 3 library cell density is ~1.15-1.3X lower than TSMC N3E.
  13. F

    TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire

    I think the key new development here is that they have confirmed that the boxes of confidential materials were taken; before it seemed to be hearsay. So this begs the question of how TSMC could have let him take them. Presumably, it was under the agreement that he would not be joining Intel or...
  14. F

    TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire

    It should be innocent until proven guilty, so they may have considered the materials in the boxes to be proof. Wei-Jen should have gotten a lawyer by now.
  15. F

    Intel completes installation of EXE:5200B High-NA EUV tool

    "Multipass or multiexposure flows" were supposed to be avoided for High-NA, or so goes the marketing. Apparently still necessary for <40 nm pitch, and stitching gives additional reason.
  16. F

    Intel completes installation of EXE:5200B High-NA EUV tool

    How Collaboration in High NA EUV and Transistor R&D Are Shaping Future Waves of Device Innovation LoriScott Employee 12-15-2025 Semiconductor innovation has always been a team sport, with the most durable breakthroughs resulting from deep ecosystem collaboration starting in research and...
  17. F

    TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire

    TSMC senior vice president Wei-Jen Lo has moved to Intel, drawing industry attention over potential risks to sensitive advanced-process expertise, and new details are now emerging. According to Liberty Times, industry sources say investigators searched Lo’ s residence in late November, seized...
  18. F

    Prosecutors Indict Former Samsung Executive and Others for Leaking ‘K-Semiconductor’ Technology to China’s CXMT

    CXMT is currently making 1x and 1z (G3 and G4) DRAM, so any impact to Samsung or SK hynix suggests they are still relying on these older nodes for revenue? Maybe just in China?
  19. F

    Intel at Barclays 2025: Roadmap, manufacturing, demand and margins under pressure

    Agreed, and it shouldn't be such a smooth curve either.
  20. F

    Exclusive-How China built its ‘Manhattan Project’ to rival the West in AI chips

    On X, user JD passed me this video where then GlobalFoundries CEO Tom Caulfield mentions at ~16:45 that one went back to ASML for refurbishment, the other went to a "research organization." If this research organization had been IMEC or CNSE (Albany), they would have happily announced the...
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