Micron HBM Market Data

[Daniel Nenni]

Interesting read:

"The HBM market will exhibit robust growth over the next few years. In 2028, we expect the HBM total addressable market (TAM) to grow four times from the $16 billion level in 2024 and to exceed $100 billion by 2030. Our TAM forecast for HBM in 2030 would be bigger than the size of the entire DRAM industry, including HBM, in calendar 2024. This HBM growth will be transformational for Micron, and we are excited about our industry leadership in this important product category."

"We have increased our HBM market TAM estimate to now exceed $30 billion in 2025, and we continue to expect to achieve HBM market share commensurate with our overall DRAM market share sometime in the second half of calendar 2025. As we have said before, our HBM is sold out for calendar 2025, with pricing already determined for this time frame. In fiscal 2025, we expect to generate multiple billions of dollars of HBM revenue."

https://investors.micron.com/static-files/21b50828-dd30-429f-9502-b1ebc452c6e3

 

[Dougwithau]

Question to ask, "Is the margin the same for HBM as singe die package DRAM?"
HBM is a multi chip module with stacked die.

 

[Barnsley]

https://www.businesstimes.com.sg/co...-advanced-packaging-site-1400-jobs-be-created

Micron invests US$7 billion in Woodlands advanced packaging site; 1,400 jobs to be created​

The company currently employs more than 9,000 people in Singapore

• Micron says the new facility will be the first of its kind in Singapore, and will package its latest HBM3E products.

MICRON Technology broke ground on its high-bandwidth memory (HBM) advanced packaging facility on Wednesday (Jan 8) in Singapore, adjacent to its existing facilities in Woodlands.
The company will invest US$7 billion in the facility “through the end of the decade and beyond”, creating around 1,400 jobs. As part of future site expansions, 1,600 more jobs may be brought about.
HBM is a form of semiconductor chip that is used in artificial intelligence (AI) training and inference.

 

[adramtech]

Question to ask, "Is the margin the same for HBM as singe die package DRAM?"
HBM is a multi chip module with stacked die.

It's much higher