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Mainstream Chipmakers Are Now Involved In The "Glass Substrate" Race, Prompting Taiwanese Suppliers To Leverage The Hype, NVIDIA Also Plans To Leverage Glass Substrate Technology For Future Chips
Intel and TSMC launch glass substrate and platform equipment manufacturers to form alliance to grab orders
Under NVIDIA's constant urging, TSMC not only announced that it has invested in the field of FOPLP, but will also restart the previously shelved glass substrate technology and compete head-on with Intel, which has already invested in the research and development of this technology for 10 years.
Not only TSMC and Intel, but Samsung and Huawei are also preparing for the battle. This huge upgrade of packaging equipment materials has updated business opportunities, attracting the global equipment industry chain to deploy and grab orders. Taiwanese manufacturers quickly established the "E-core System Alliance of Glass Substrate Suppliers" ”, the ant army grabs orders from major manufacturers.
Under NVIDIA's constant urging, TSMC not only announced that it has invested in the field of FOPLP, but will also restart the previously shelved glass substrate technology and compete head-on with Intel,
From what we’re seeing of the limitations and shortfalls of silicon, and hybrid (silicon/organic) interposers, glass substrates or wafer scale integration are inevitable to for the data center.
"But it’s more likely that Intel takes a less dramatic step before it reaches that point, such as holding off on some of its expansion plans, the people said."
"But it’s more likely that Intel takes a less dramatic step before it reaches that point, such as holding off on some of its expansion plans, the people said."
wccftech.com
