EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference …
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September 29 - October 2, 2025 Co-located with Semiconductor thermal management Town & Country resort San Diego, California The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in San Diego, California. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical …
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
