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Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have …
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