Electronic Packaging Days 2025
Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25, Building 17/3, Berlin, GermanyOn 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …