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Join us to hear firsthand from the innovators at Siemens and Alphawave Semi and learn proven practices to enhance your UCIe-enabled AI system performance! The semiconductor industry is shifting rapidly from monolithic SoC design to chiplet-based systems. At the same time, AI compute workloads have pushed into petaflop-class speeds, demanding higher throughput from die-to-die (D2D) …
All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
