Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration
OnlineMemory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications. However, integrating HBM …
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