The RISC-V Summit Europe is the premier event that connects the European movers and shakers – from industry, government, research, academia and ecosystem support – that are building the future of innovation on RISC-V. RISC-V, the open standard instruction set architecture (ISA), is enabling a range of new applications and research that will define the future of computing …
Join the UK’s largest expo dedicated to cutting-edge hardware technology for innovation-driven engineers At Hardware Pioneers Max you have the unique opportunity to meet with leading experts and suppliers that can help you learn faster, make better decisions and speed up your product development process. REGISTER HERE
June 10 8:00 AM - June 11 5:00 PM CEST 2026 European Executive Forum Munich, Germany REGISTER HERE
“How Will Agentic AI Change Chip Design and Verification?” features EDA and emerging agentic AI company executives and entrepreneurs discussing changes within chip design and verification as agentic AI tools become more mainstream. Panelists will distill the excitement surrounding the innovation in chip design and verification, collaboration between traditional EDA and agentic AI startups and …
New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing …
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation …
**Work Email Required for Registration** Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance. This includes requirements, architecture, implementation, verification, hardware bring-up, firmware, and customer documentation. Local correctness does not guarantee lifecycle coherence. llmda.ai believes that consistency itself should …
Continue reading "Webinar: How Agentic AI Keeps Documentation Consistent and Accurate"
Themed Heterogeneous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging …
CONFERENCE & EXHIBITION HPC, AI, Quantum: Powering Innovation and Sustainability ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies, as well as what lies ahead. Additionally, we are committed to sustainability by promoting energy-efficient …
Verification Futures UK 2026, co-located with Semiconductors Futures 2026 organised by Tessolve and co-organised this year with Alpinum. The conference continues its strong tradition of delivering a unique blend of conference presentations, exhibitions, training, and industry networking sessions focused on the challenges faced in hardware and software verification. The event remains an important forum for …
CEA-Leti’s flagship event Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026. Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors. Leave with confidence in the possible. REGISTER HERE
Join us to get the latest on: TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
