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Discover the 5 Critical Manufacturing Market Trends Reshaping Semiconductors in 2026 AI-driven investments, sustainability, and advanced materials—what’s next for semiconductor manufacturing. The semiconductor manufacturing industry is undergoing a transformative period as AI-driven investments accelerate, sustainability pressures mount, and foundries navigate capacity expansion amid weak consumer demand. In this live TechInsights webinar, our manufacturing experts will …
About this event Start the new year off right with fresh insights and sharp skills. Join Keysight experts in Calgary for an all-day Advanced Measurements Seminar and cocktail reception. This hands-on technical event features live demonstrations with the latest RF and high-speed digital technologies. Gain practical, lab-ready insights to enhance accuracy, reduce uncertainty, and push your measurement capabilities further in 2026. Lunch and cocktails are on us. …
ASU Tempe Campus
ASU Tempe Campus, Old Main Building, 400 East Tyler Mall, Second Floor, Tempe, AZ, United States
This workshop is a fast-paced, one-day program led by Prof. Dragica Vasileska and Prof. Stephen M. Goodnick. Spend the morning grounding yourself in semiconductor physics and transport, then transition in the afternoon to instructor-led, hands-on Silvaco TCAD labs (e.g., MOS Capacitors, MOSFETs, SOI Devices, FinFETs). The workshop is offered in a hybrid format. Participants have …
San Francisco, CA
San Francisco, CA, United States
Share your work, insights, and breakthroughs. The 2026 call for papers is open. SPIE Photonics West is the world’s largest optics and photonics technologies event. Present your research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum, and emerging vision technologies. Conferences and Courses: 17–22 January This is the place to be in January …
SEMI HQ
SEMI HQ, 673 S Milpitas Blvd., Milpitas, CA, United States
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
San Francisco, CA
San Francisco, CA, United States
About this event Stay connected with the latest optical design product innovations across CODE V, LightTools, RSoft, ImSym, and our optical scattering measurement solutions. Get tips and tricks on design best practices from our experts, and network with industry peers and the Keysight Optical Design Engineering team. The user conference is held in parallel with …
On October 17-18, 2024, Israel launched a deadly attack on Hezbollah in Lebanon and Syria using tampered pager and walkie-talkie devices, nicknamed “Operation Grim Beeper.” The exploding pager attack illustrates the vulnerability of the electronics supply chain to a dedicated nation-state adversary. We will explain how the supply was compromised and focus specifically on the …
Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process, its resolution begins at the architectural level and extends through the …
In this webinar, we will explore the growing threat that AI-fueled cyberattacks pose to chip designs and how to add expert-level security verification to your design flow to minimize those risks. We will expose some of the details of the existential risk for electronic systems with real examples. We will then describe technology that easily …
San Francisco Marriott Marquis
San Francisco Marriott Marquis, 780 Mission Street, San Francisco, CA, United States
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
Santa Clara Convention Center
Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States
All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Hyatt Regency San Francisco Airport
1333 Bayshore Highway, Burlingame, CA, United States
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
San Jose McEnery Convention Center
San José McEnery Convention Center, 150 W San Carlos St, San Jose, CA, United States
From materials to metrology: pushing the limits of lithography Share your research, challenges, and breakthroughs at this leading semiconductor conference in San Jose Submit your abstract and connect with leading researchers advancing solutions in optical lithography, EUVL, patterning technologies, metrology, and process integration for semiconductor manufacturing and related applications. Call for papers is now open. …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
The WIGWAM
The Wigwam, 300 E Wigwam Blvd, Litchfield Park, AZ, United States
FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
Hyatt Regency Hotel, Santa Clara, CA
Santa Clara, CA, United States
DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is …
Fira Gran Via, Barcelona
Fira Gran Via, Av. Joan Carles I, 64, Barcelona, Spain
Making way for The IQ Era Much can happen in a year within our ecosystem of innovation and connectivity. As we build on the success of MWC25 and engage with MWC26 to activate a new theme – The IQ Era – the world is already shifting to greater heights of digital awareness. In this new age of intelligence, the way to a better future is through smarter connection: human …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
Exhibition Centre Nuremberg
Exhibition Centre Nuremberg, Messezentrum 1, Nürnberg, Germany
Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …
