Samsung’s Hot Chips 2026 presentation, “HBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,” argues that the base die beneath a High Bandwidth Memory stack is about to become far more than a communications layer. Traditionally, an HBM base die mainly connects stacked DRAM dies to a GPU, TPU, or other processor and … Read More
HBM’s Second Act: When Memory Starts Thinking
